Innovative Solutions for your Critical Applications

Teledyne Micropac provides optoelectronic components, electronic assemblies and multi-chip microelectronic modules.

Serving your high-reliability applications

Our expertise uniquely positions us to excel in serving highly technical market segments, ensuring precision, innovation, and reliability in every solution we deliver.

Space

Teledyne Micropac supplies space level microcircuit modules and components in “mission critical” applications on launch vehicles, spacecraft, Mars Rovers, the International Space Station, spacesuits, and space telescopes.

Military

Teledyne Micropac has components to support your mission critical application above ground.

Industrial

Teledyne Micropac has power switching and load monitoring that are essential for system protection and performance.

Medical

Teledyne Micropac provides the precision and reliability that ensures that patients are safely treated.

Business Units

Driving your mission in the right direction

Teledyne Micropac is accelerating the pace of innovation for optoelectronic and microelectronic design and packaging to meet new mission requirements for space, military, industrial, and medical markets. We employ focused initiative to drive cost, performance, time-to-market and reliability to meet mission requirements.

Business Units
Microelectronics
Industries' first source for high reliability, harsh environment power electronic solutions
Optoelectronics
Developing the next generation fiber optic and opto electronic solutions for mission critical applications
Sensors & Displays
Proximity and position sensors, severe application display solutions, and multi-function LEDs for every requirement

News & Events

Press releases and trade-shows that you need to know.

Event

Space Symposium

Teledyne Micropac will be at the Space Symposium in Colorado Springs, CO. Stop by our booth to learn more about our advanced space solutions and meet our experts.

Ready to obtain mission success?

Teledyne Micropac is accelerating the pace of innovation for optoelectronic and microelectronic design and packaging to meet new mission requirements. Contact our sales department for more information.